Optical Glass Wafer
OST Photonics offers a variety of optical glass wafers and fused silica wafers depending on the application and material requirements. Wafer diameters are ranging from 3 inches to 12 inches, the thickness can be customized according to your requirements (generally above 0.1 mm). We have a wide range of glass materials for you to choose from:
- Fused silica material: JGS1/JGS2/JGS3
- SHOTT glass: Borofloat33/D263Teco/B270(I)/D263(T) and microcrystalline glass etc.
- Corning glass: Corning 7980/7978/7979 and Eagle XG etc.
- Ohara glass: SK-1300/SK-1310/SK-1320 etc.
- Feilihua: F-HUV1~7 etc.
- CDGM: H-K9L etc.
- Other glass materials: Soda Lime etc.
Specifications of Optical Glass Wafer and Fused Silica Wafers
Material | Fused silica material: JGS1/JGS2/JGS3 SHOTT glass : Borofloat33/D263Teco/B270(I)/D263(T) and microcrystalline glass etc. Corning glass: Corning 7980/7978/7979 and Eagle XG etc. Ohara glass: SK-1300/SK-1310/SK-1320 etc. Feilihua: F-HUV1~7 etc. CDGM: H-K9L etc. Other glass materials: Soda Lime etc. | |||||
Diameter | 3” (76.2mm) | 4” (100mm) | 6″ (150mm) | 8″ (200mm) | 10” (250mm) | 12” (300mm) |
Diameter Tolerance(±) | ≤0.20 mm | |||||
Thickness | ≥0.1mm | ≥0.1mm | ≥0.3mm | ≥0.4mm | ≥0.5mm | ≥0.5mm |
Primary reference flat | According to our standards or your requests | |||||
LTV (5mmx5mm) | < 0.5µm | |||||
TTV | < 2µm | < 2µm | < 3µm | <3µm | <5µm | <5µm |
Bow | ±20µm | ±20µm | ±30µm | ±40µm | ±40µm | ±40µm |
Warp | ≤ 30µm | ≤ 30µm | ≤ 40µm | ≤ 50µm | ≤ 50µm | ≤ 50µm |
PLTV(5mm*5mm)<0.4um | ≥95% | ≥95% | ≥95% | ≥95% | ≥95% | ≥95% |
Edge Criteria | Compliant with SEMI M1.2 Standard/refer to IEC62276 | |||||
Surface Type | Single side polished(SSP)/double sides polished(DSP) | |||||
Polished side Ra | ≤0.5 nm | |||||
Back Side Criteria | General is 0.2-0.7µm or as customized | |||||
Packaging | 25pcs per box | |||||
Process Capability of Optical Glass Wafers
Dimension | 5mm – 400mm |
Thickness | ≥0.05mm |
Dimensional Tolerance | ±25μm |
Thickness Tolerance | ±5μm |
Thickness Variation(TTV) | < 2μm |
Flatness | 1/10 Wave/Inch |
Surface Roughness (RMS) | <5Ǻ |
Scratch and Dig | 10/5 |
Particle Size | <10μm |
Bow/Warp | <10μm |